Cooling apparatus having low profile extrusion and method of manufacture therefor

ABSTRACT

A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member. Cooling of the heat transfer fluid within the condenser section is enhanced by the second plurality of low profile extrusion members. The heat transfer fluid is returned to the evaporator section after cooling.

CROSS-REFERENCE

This application is a continuation of U.S. application Ser. No.11/336,698, filed Jan. 20, 2006 now U.S. Pat. No. 7,802,436. U.S.application Ser. No. 11/336,698 is a continuation of U.S. applicationSer. No. 10/328,537, filed Dec. 23, 2002, now U.S. Pat. No. 6,988,315.U.S. application Ser. No. 10/328,537 is a divisional of U.S. applicationSer. No. 09/328,183, filed Jun. 8, 1999, now U.S. Pat. No. 6,935,409.U.S. application Ser. No. 09/328,183 claims the benefit of U.S.Provisional Application No. 60/088,428, filed Jun. 8, 1998. U.S.application Ser. No. 11/336,698, U.S. application Ser. No. 10/328,537,U.S. application Ser. No. 09/328,183, and U.S. Provisional ApplicationNo. 60/088,428 are each incorporated herein by reference.

BACKGROUND

The present invention generally pertains to cooling apparatus, and moreparticularly, but not by way of limitation, to cooling apparatus using“low profile extrusions”. As is explained in greater detail hereinbelow,such apparatus are extremely useful in printed circuit board (PCB) levelcooling of electronic components, and for use as heat exchangers inapplications where space is limited and/or low weight is critical. Thepresent invention also pertains to an improved, high volume apparatusand method for manufacturing extruded hollow tubes for heat exchangersand heat pipes, including “low profile extrusions”.

As used in this document, the term “low profile extrusion” refers to aheat exchange apparatus comprising an integral piece of metal having aseries of micro extruded hollow tubes formed therein for containing afluid. The low profile extrusions preferably have multi-void microextruded tubes designed to operate under the pressures and temperaturesrequired by modern environmentally safe refrigeration gases and toresist corrosion.

The micro extruded tubes are preferably interconnected at their ends soas to provide fluid communication between each tube. Such low profileextrusions are preferably formed from aluminum, although otherconventional metals or metal alloys may also be used. The micro tubescan have a diameter from about 0.0625 inches to about 0.5 inches, butcan also have significantly smaller diameters.

Such low profile extrusions can currently be manufactured with aprofile, or height, as low as about 0.05 inches and with tubes ofvarying inner diameters. Of course, future advances may allow such lowprofile extrusions to be manufactured with an even smaller profile. Suchlow profile extrusions have been conventionally used in heat exchangerapplications in the automotive industry, and are commercially availablein strip form (having a generally rectangular geometry) or coil form (acontinuous strip coiled for efficient transport). Preferred low profileextrusions are sold by Thermalex, Inc. of Montgomery, Ala. A brochureentitled “Thermalex, Inc.—Setting A Higher Standard in AluminumExtrusions” (hereinafter the “Thermalex Brochure”) provides additionaldetail regarding the Thermalex low profile extrusions and isincorporated herein by reference. U.S. Pat. No. 5,342,189, which isincorporated herein by reference, provides additional detail regardingan extrusion die for making such low profile extrusions. U.S. Pat. No.5,353,639, which is incorporated herein by reference, providesadditional detail regarding a method and apparatus for sizing aplurality of micro extruded tubes used in such low profile extrusions.

SUMMARY OF THE INVENTION

In one embodiment, the present invention generally comprises a lowprofile extrusion, an inlet end cap, an inlet tube, an outlet end cap,an outlet tube, a heat transfer fluid, a means for circulating the heattransfer fluid, end means for removing heat from the heat transferfluid. The low profile extrusion has a plurality of micro tubes withmicro tube inlets and micro tube outlets, and an extrusion surfaceadapted for receiving heat from at least one heat generating component.The inlet end cap interconnects the micro tube inlets in fluidcommunication and connects the micro tube inlets in fluid communicationwith the inlet tube. The outlet end cap interconnects the micro tubeoutlets in fluid communication and connects the micro tube outlets influid communication with the outlet tube. The means for circulating theheat transfer fluid circulates the fluid through the inlet tube, inletend cap, the plurality of micro tubes in the low profile extrusion, theoutlet end cap, and the outlet tube.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the method and apparatus of the presentinvention may be obtained by reference to the following DetailedDescription when taken in conjunction with the accompanying Drawingswherein:

FIG. 1 is a schematic illustration of the present invention, shown as acirculation cooling apparatus for removal of heat from certain heatgenerating components;

FIGS. 2 and 3 are schematic illustrations of another embodiment of thepresent invention, shown as the heat pipe type cooling apparatus forremoval of heat from certain heat generating components;

FIG. 4 is a schematic illustration of another embodiment of the presentinvention, shown as heat transfer component of a recirculatory system;

FIG. 5A is a schematic illustration of another embodiment of the presentinvention, shown as a liquid to liquid manifold cooling apparatus;

FIG. 5B is a schematic illustration of another embodiment of the presentinvention, shown as a liquid to air manifold cooling apparatus;

FIG. 5C is a schematic illustration of another embodiment of the presentinvention, shown as an air to air manifold cooling apparatus;

FIG. 6 is a is a schematic illustration of a method and apparatus formanufacturing heat pipes according to an embodiment of the presentinvention;

FIG. 7 is a schematic illustration of another embodiment of the presentinvention, shown as heat pipe base/fin cooling apparatus; and

FIG. 8 is a schematic illustration of another embodiment of the presentinvention, shown as a base/heat pipe fin cooling apparatus.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS OF THE INVENTION

The preferred embodiments of the present invention and their advantagesare best understood by referring to FIGS. 1-8 of the drawings, likenumerals being used for like and corresponding parts of the variousdrawings. The present invention is illustrated herein by example, andvarious modifications may be made by a person of ordinary skill in theart.

FIG. 1 is a schematic illustration of a first preferred embodiment ofthe present invention showing a cooling apparatus 10 used for removingheat from certain heat generating components 12 mounted on a printedcircuit board 14. The printed circuit board 14 may be housed in a hostelectronic device (not shown) such as computer, a laptop or notebookcomputer, or other electronic equipment. Due to the ongoingminiaturization of such host electronic devices, the heat generatingcomponents 12 are often located in an area of the printed circuit board14 and of the host electronic device where space is extremely limited,especially in the “z”, or height dimension.

The cooling apparatus 10 generally includes a conventional liquid-to-airheat exchanger 16, an inlet tube 18, a low profile extrusion 20, anoutlet tube 22, a conventional pump 24, and tubing 26. The low profileextrusion 20 has a plurality of micro tubes 21, each micro tube 21having a micro tube inlet 21 a and a micro tube outlet 21 b. Theextrusion 20 is preferably formed with a flat surface on its bottom side20 a for contacting heat generating components 12, and may be formedwith external fins on its top side 20 b to maximize heat transfer, ifspace allows. Extrusion 20 is also preferably formed with at least onesolid channel (not shown) for mounting to printed circuit board 14.Conventional thermal interface material (not shown) is preferablyprovided between low profile extrusion 20 and heat generating components12.

The micro tube inlets 21 a of the micro tubes 21 in the extrusion 20 areinterconnected in fluid communication, and to the inlet tube 18, by aninlet end cap 28 a. Similarly, the micro tube outlets 21 b of the microtubes 21 in the extrusion 20 are interconnected in fluid communication,and to the outlet tube 22, by an outlet end cap 28 b. The heat exchanger16 may contain a fluid reservoir (not shown) therein for housing a fluidsuch as water, glycol, alcohol, or other conventional refrigerants. Inthis case, fluid from the heat exchanger 16 is circulated through theinlet tube 18, the low profile extrusion 20, the outlet tube 22, and thetubing 26 via the pump 24. Alternatively, the entire cooling apparatus10 may be evacuated and charged with fluid which is then circulated viathe pump 24.

During operation of the host electronic device, heat generated by heatgenerating components 12 is transferred from heat generating components12 to low profile extrusion 20, to the fluid circulating within lowprofile extrusion 20, and then to heat exchanger 16. Heat exchanger 16removes the heat from the fluid in a conventional manner. Preferably, anairflow 30 is passed over heat exchanger 16 to aid in such heat removal.Cooling apparatus 10 thus efficiently removes heat from a limited space,low profile area within the host electronic device (the location of lowprofile extrusion 20) to an area where it can be removed at a moreconvenient location and envelope (the location of heat exchanger 16).

FIGS. 2 and 3 are schematic illustrations of a second preferredembodiment of the present invention showing a cooling apparatus 40 usedfor removing heat from heat generating components 12 on printed circuitboard 14. Referring first to FIG. 2, cooling apparatus 40 generallycomprises a low profile extrusion 42 manufactured as a heat pipe capableof phase change heat transfer. A preferred method of making a lowprofile heat pipe extrusion 42 is described in greater detailhereinbelow. The low profile heat pipe extrusion 42 is preferably formedwith micro tubes 41, each micro tube 41 having a conventional wickstructure such as internal fins, grooved inner sidewalls, or metalscreens, so as to maximize their heat transfer capability via capillaryaction.

To form a heat pipe, the micro tubes 41 of the low profile heat pipeextrusion 42 are evacuated and then charged with a fluid such as water,glycol, alcohol, or other conventional refrigerants before sealing theends 41 a and 41 b of the micro tubes 41. As is known in the art, a heatpipe generally has an effective thermal conductivity of severalmultiples higher than that of a solid rod. This increase in efficiencyis due to the fact that the phase change heat transfer coefficients arehigh compared to the thermal conductivity of conventional materials.

The low profile heat pipe extrusion 42 is preferably formed into a firstportion 44 for contacting heat generating components 12 and a raisedsecond portion 46. First portion 44 and second portion 46 are preferablysubstantially similar in construction to low profile extrusion 20 ofFIG. 1, except end caps 28 are not required. First portion 44 acts asthe evaporator section of the heat pipe, and second portion 46 acts asthe condenser section of the heat pipe.

During operation of the host electronic device, heat generated by heatgenerating components 12 is transferred from heat generating components12 to first portion 44. This heat causes the liquid within the microtubes 41 in first portion 44 to change to vapor, consuming some of thegenerated heat. Because the vapor is less dense than the surroundingliquid, the vapor and associated heat rise into the micro tubes 41 insecond portion 46. Of course, heated liquid may also be transferred fromfirst portion 44 to second portion 46 via the capillary action of thewick structures of the micro extruded tubes therein. In second portion46, the vapor condenses into liquid onto the inner side walls of themicro extruded tubes 41. The heat generated by the condensationreaction, as well as any heat transferred via capillary action of thewick structure, is then transferred to air flow 48. Cooling apparatus 40thus efficiently removes heat from a limited space, low profile areawithin the host electronic device (the location of first portion 44) toan area where it can be removed at a more convenient location andenvelope (the location of second portion 46). Of course, if low profileheat pipe extrusion 42 is formed with internal wick structures, it isnot necessary that second portion 44 be raised from, or higher than,first portion 42.

Referring now to FIG. 3, low profile heat pipe extrusion 42 is shown inoperation with a conventional thermoelectric cooler (TEC) 50 in contactwith one of heat generating components 12. A preferred TEC is sold byMarlow Industries, Inc. of Dallas, Tex. TEC 50 facilitates the heattransfer between the heat generating component 12 and first portion 44of low profile heat pipe extrusion 42, and thus is preferred for usewith heat generating components 12 that have high power densities.

FIG. 4 is a schematic illustration of a third preferred embodiment ofthe present invention showing a cooling apparatus 60 used for removingheat from a fluid 62, such as water, glycol, alcohol, or otherconventional refrigerants. Fluid 62 is then used to cool conventionalheat generating components, such as heat generating components 12 ofprinted circuit board 14. By way of example, cooling apparatus 60 may beused in place of conventional heat exchanger 16 in FIG. 1.

Cooling apparatus 60 generally comprises a low profile extrusion 64, aninlet end cap 63 a, an inlet tube 66, an outlet end cap (not shown), anoutlet tube (not shown), thermoelectric coolers 52, and conventionalbonded fin heat sinks 68 and 70. The low profile extrusion 64 ispreferably substantially similar in construction to low profileextrusion 20 of FIG. 1, with a plurality of micro tubes (not shown)having a micro tube inlet and a micro tube outlet (not shown). The microtube inlets of the micro tubes in the extrusion 64 are interconnected influid communication, and to the inlet tube 66, by the inlet end cap 63a. Similarly, the micro tube outlets of the micro tubes in the extrusion64 are interconnected in fluid communication, and to the outlet tube, byan outlet end cap.

The low profile extrusion 64 preferably has generally flat bottom andtop surfaces for contact with thermoelectric coolers (TEC) 52. Theconventional bonded fin heat sink 68 is coupled to TECs 52 on the topsurface of low profile-extrusion 64, and the conventional bonded finheat sink 70 is coupled to TECs 52 on the bottom surface of low profileextrusion 64.

In operation, the low profile extrusion 64 serves as a manifold, and theTECs 52 remove heat from fluid 62 flowing through the micro tubes of thelow profile extrusion 64. This removed heat is transferred from TECs 52to bonded fin heat sinks 68 and 70, which dissipate the heat toatmosphere in a conventional manner. Preferably, airflows 72 and 74 passover and through heat sinks 68 and 70 to facilitate such heatdissipation.

Low profile extrusion 64 has a smaller size and mass than conventionalheat exchanger manifolds. For example, a conventional manifold has aminimum profile, or height, in the “z” direction of about 0.75 inches,and low profile extrusion 64 may have a profile as low as about 0.1inches. The reduced mass of low profile extrusion 64 is believed toproduce a cooling apparatus 60 with a near zero time constant,increasing startup performance and temperature control. Therefore,cooling apparatus 60 is especially advantageous in applicationsinvolving lasers. The wavelength of a laser beam, and thus beamproperties, is strongly influenced by temperature, and the tightertemperature control believed to be provided by cooling apparatus 60 isextremely beneficial.

FIGS. 5A, 5B, and 5C are schematic illustrations of fourth, fifth, andsixth preferred embodiments of present invention. FIG. 5A shows acooling apparatus 80 having a plurality of low profile extrusions 64 andTECs 52 arranged in a serial fashion. A TEC 52 is disposed between, andis in contact with, each of the extrusions 64. Only one low profileextrusion 64 and one TEC 52 is numbered in FIG. 5A for clarity ofillustration. Fluid 62 enters each extrusion 64 via inlet 66 and exitseach extrusion 64 via an outlet 82. In operation, TECs 52 remove heatfrom fluid 62 flowing through low profile extrusions 64. This removedheat is transferred to airflow 84 passing over cooling apparatus 80.

FIG. 5B shows a cooling apparatus 90 having a plurality of low profileextrusions 64, TECs 52, and low profile heat pipe extrusions 92 arrangedin a serial fashion. More specifically, a TEC 52 is disposed between,and is in contact with, each low profile extrusion 64 and low profileheat pipe extrusion 92. Only one low profile extrusion 64, one TEC 52,and one low profile heat pipe extrusion 92 are numbered in FIG. 5B forclarity of illustration. Each low profile heat pipe extrusion 92 ispreferably substantially similar in construction to low profile heatpipe extrusion 42 of FIG. 1, excluding raised portion 46. Fluid 62enters each extrusion 64 via inlet 66 and exits each extrusion 64 viaoutlet 82. In operation, each TEC 52 removes heat from fluid 62 flowingthrough an adjacent low profile extrusion 64. This removed heat istransferred to the evaporator portion 92 a of the adjacent low profileheat pipe extrusion 92. The heat is then transferred to the condenserportion 92 b of the low profile heat pipe extrusion 92, as is explainedhereinabove in connection with low profile heat pipe extrusion 42 ofFIGS. 2 and 3. An airflow 84 passing over cooling apparatus 90dissipates heat from each condenser portion 92 b of each low profileheat pipe extrusion 92.

FIG. 5C shows a cooling apparatus 100 having a plurality of TECs 52 andlow profile heat pipe extrusions 92 arranged in a serial fashion. Morespecifically, a TEC 52 is disposed between, and is in contact with, eachlow profile heat pipe extrusion 92, and the “free end” of adjacent lowprofile heat pipe extrusions 92 extend in opposite directions. Only oneTEC 52 and two low profile heat pipe extrusions, 92′ and 92″, arenumbered in FIG. 5C for clarity of illustration. In operation, a hotairflow 102 flows over each evaporator portion 92 a of low profile heatpipe extrusions 92′. This heat is transferred from evaporator portion 92a to condenser portion 92 b of extrusion 92′, as is explainedhereinabove in connection with low profile heat pipe extrusion 42 ofFIGS. 2 and 3. Condenser portion 92 b of extrusion 92′ is in contactwith TEC 52. The TEC 52 removes heat from condenser portion 92 b ofextrusion 92′ and transfers it to evaporator portion 92 a of low profileheat pipe extrusion 92″. This heat is then transferred from evaporatorportion 92 a to condenser portion 92 b of extrusion 92″. Cold airflow104 passing over condenser portions 92 b of each extrusion 92″dissipates heat from cooling apparatus 100.

Cooling apparatus 80, 90, and 100 have the same applications andadvantages of cooling apparatus 60 described hereinabove. As will beappreciated by one skilled in the art, cooling apparatus 60, 80, and 90may also be operated as heating apparatus by using thermoelectriccoolers (TECS) 52 to heat, rather than to cool, a fluid.

FIG. 6 is a schematic illustration of a method and apparatus formanufacturing heat pipes according to a seventh preferred embodiment ofthe present invention. As noted hereinabove, the preferred apparatus andmethod may be utilized to make low profile heat pipe extrusions 42 and92 of FIGS. 2, 3, 5B, and 5C. However, the preferred apparatus andmethod may also be utilized to make extruded hollow tubes for other heatexchangers and heat pipes.

Apparatus 110 generally includes an oven 112 having a sealable housing.A vacuum station 114 and a fluid charging station 116 are in fluidcommunication with oven 112. A coil 118 is disposed within a portion ofoven 112 on a conventional automatic feed system. Coil 118 may be a coilof hollow tubing, a coil of low profile extrusion, or a coil of otherconventional extrusion having a series of extruded hollow tubes therein.An ultrasonic welder/sealer is also disposed in oven 112. A preferredultrasonic welder/sealer is the Ultraseal® series sold by AmericanTechnology, Inc. of Shelton, Conn. A brochure entitled “Ultraseal®-20 20kHz Portable Ultrasonic Metal Tube Sealer” (hereinafter the “AmtechBrochure”) provides additional information regarding the Ultraseal®series of ultrasonic welder/sealers and is incorporated herein byreference.

In a conventional process, the first step is actually forming andcutting the heat exchanger, heat pipe, or extruded tubes into thedesired configuration. Next, this preformed system is evacuated andcharged with a fluid such as water, glycol, alcohol, or otherconventional refrigerants. The system is then sealed, completing theprocess. Conventional processes are expensive because they are laborintensive and require long setup times for different configurations ofheat exchangers, heat pipes, or extruded tubes.

However, apparatus 110 may be used to efficiently and economicallyproduce heat exchangers, heat pipes, and extruded tubes, including lowprofile extrusions, according to the following preferred process. First,coil 118 is placed within oven 112 on the automatic feed system. Second,coil 118 is evacuated using vacuum station 114. Preferably, coil 118 ispulled down to a vacuum of about 10.sup.-7 torr for a period ofapproximately twenty four hours. Third, coil 118 is charged with a knownamount of fluid, such as water, glycol, alcohol, or other conventionalrefrigerants, using charging station 116. Fourth, oven 112 heats coil118 until all of the fluid is in the vapor phase, and the vapor fillsthe interior of coil 118 evenly. Fifth, using the automatic feed system,the heated and charged coil 118 is reeled out, and is crimped, sealed,and cut into desired lengths using ultrasonic welder/sealer 120. Whenforming tube heat pipes, ultrasonic welder/sealer 120 preferably canoecrimps the extrusions. Finished product is collected within container122. In this manner, heat exchangers, heat pipes, and extruded tubes,including low profile extrusions, are formed while charged with fluid,significantly reducing the setup time and vacuum expense overconventional processes.

FIG. 7 illustrates another embodiment of the present invention, showinga cooling apparatus 210 used for removing heat from heat generatingcomponents 12 on printed circuit board 14. The cooling apparatus 210comprises a low profile extrusion 220 manufactured as a heat pipecapable of phase change heat transfer. The low profile heat pipeextrusion 220 is formed having a plurality of micro tubes 230,preferably having therein conventional wick structure inside such asinternal fins, grooved inner side walls, or metal screens, so as tomaximize there heat transfer capability via capillary action. The microtubes 223 of the low profile heat pipe extrusion 220 are evacuated andthen charged with a fluid such as water, glycol, alcohol, or otherconventional refrigerants, before the ends of the micro tubes aresealed.

The low profile heat pipe extrusion 220 has a first surface 221 forengaging the heat generating components 12 and receiving heat transfertherefrom. On a second surface 222 of the low profile extrusion 220, aconventional bonded fin heat sink 230 or plurality of cooling fins aremounted to the low profile extrusion 220. Preferably, the micro tubes223 are disposed in a direction perpendicular to the fins 230 fortransfer of heat between each of the individual fins 230. The heattransfer between the individual fins 230 promotes the even distributionof heat across each of the individual fins 230. However, the micro tubes223 can be oriented for the transfer of heat along the length of thefins 230. Additionally, in one preferred embodiment, the micro extrudedhollow tubes 223 in the low profile extrusion 220 are oriented fordisbursing heat from the heat generating components 12 to areas of thelow profile extrusion 220 which are not in contact with a heatgenerating components 12.

The use of the low profile extrusion 220 for transferring heat in thecooling apparatus 200 increases the effective surface area that heat istransferred from the heat generating components to the cooling fins 230.The resulting cooling apparatus is therefore smaller in size and lighterin weight for the same effective cooling attributes. In someembodiments, the present invention can decrease the weight of anapparatus for cooling a heat generating component by as much as 50% overtraditional fins mounted via a metal plate.

FIG. 8 illustrates another embodiment of the present invention, showinga cooling apparatus 250 used for removing heat from heat generatingcomponents 12 on printed circuit board 14. The cooling apparatusgenerally comprises a base 260 and a plurality of low profile extrusionfins 270. The base 260 has a first side 261 for heat transfer betweenthe cooling apparatus 250 and heat generating components 12. The base260 also has a second surface 262 for mounting the low profile extrusionfins 270.

The low profile extrusion fins 270 are low profile extrusionsmanufactured as a heat pipe capable of phase change heat transfer. Thelow profile extrusion heat piping 270 are preferably formed with aplurality of micro tubes 273 each preferably having a conventional wickstructure such as internal fins, grooved inner side walls, or metalscreens, so as to maximize the heat transfer capability via capillaryaction. The micro tubes 273 of the low profile extrusion heat piping 270are evacuated and then charged with a fluid such as water, glycol,alcohol, or other conventional refrigerants, before the micro tubes 273are sealed.

A first end 271 of the low profile extrusion fins 270 is mounted to thesecond surface 262 of the base 260 with a second end 272 extendingoutwardly therefrom. The plurality of low profile extrusion fins 270 arepreferably mounted in rows for convection heat transfer to thesurrounding environment. In one embodiment, the base 260 can also beformed from a low profile extrusion similar to the low profile extrusion220 in FIG. 7.

The use of the heat pipe type low profile extrusion fins 270 in thecooling apparatus 250 increases the effective surface area in which heatis transferred from the heat generating components to the surroundingenvironment via the base 260. The resulting cooling apparatus istherefore smaller in size and lighter in weight for the same effectivecooling attributes.

It is believed that the operation and construction of the presentinvention will be apparent from the foregoing description of a preferredembodiment. While the device shown is described as being preferred, itwill be obvious to a person of ordinary skill in the art that variouschanges and modifications may be made therein without departing from thespirit and scope of the invention as defined in the following claims.Therefore, the spirit and the scope of the appended claims should not belimited to the description of the preferred embodiments containedherein.

What is claimed is:
 1. A cooling apparatus for removing heat, saidcooling apparatus comprising: a low profile unitary member having anevaporator portion and a condenser portion, the evaporator portion beingthermally exposed to a heat generating component, the condenser portionbeing disposed at an elevated angle with respect to the evaporatorportion; a thermoelectric cooler disposed between, and thermally exposedto, the heat generating component and the evaporator portion; aplurality of microtubes disposed within the low profile unitary member,the plurality of microtubes having a heat transfer fluid containedtherein; wherein heat is transferred, via the thermoelectric cooler,from the heat generating component to the heat transfer fluid containedwith the microtubes located within the evaporator portion; whereinheated heat transfer fluid migrates to the condenser portion of the lowprofile unitary member by way of the microtubes; wherein the heattransfer fluid is cooled in the condenser portion of the low profileunitary member; and wherein the heat transfer fluid is returned to theevaporator section after cooling.
 2. The cooling apparatus of claim 1,wherein transfer of heat from the heat generating component to the heattransfer fluid results in the heat transfer fluid changing from a liquidto a gas.
 3. The cooling apparatus of claim 1, wherein cooling of theheat transfer fluid within the condenser section results in the heattransfer fluid changing from a gas to a liquid.
 4. The cooling apparatusof claim 1, further comprising a capillary groove on an interior surfaceof each microtube of the plurality of micro tubes.
 5. The coolingapparatus of claim 1, wherein an interior space of the low profileunitary member is sealed.
 6. The cooling apparatus of claim 1, whereineach microtube of the plurality of micro tubes is polygonal in crosssection.
 7. The cooling apparatus of claim 1, wherein each microtube ofthe plurality of micro tubes is substantially square in cross section.8. The cooling apparatus of claim 1, wherein each microtube of theplurality of micro tubes has a diameter in the range of approximately0.0625 inches to approximately 0.5 inches.
 9. The cooling apparatus ofclaim 1, wherein the low profile unitary member has a profile ofapproximately 0.1 inches.
 10. The cooling apparatus of claim 1, whereineach microtube of the plurality of micro tubes are substantiallyrectangular in shape.
 11. The cooling apparatus of claim 1, wherein theheat generating component is a printed circuit board.
 12. The coolingapparatus of claim 1, further comprising at least one fin disposed on aninterior surface of each microtube of the plurality of micro tubes. 13.The cooling apparatus of claim 1, wherein the low profile unitary memberis formed of a single piece of metal.
 14. The cooling apparatus of claim1, wherein the heat transfer fluid is migrated from the evaporatorportion to the condenser portion by way.